Artificial Intelligence as a Baseline Layer of Modern Engineering
English translation
How AI is moving onto every kind of hardware and what engineers need to know next.
In the next decade, AI will not be something you “add” to a product at the end. It will be something the product is designed to host from day one - whether that product is a sensor node, an RF system, a piece of embedded hardware, or an application running on an AI-enabled laptop.
This article explains: what is changing in hardware, why models must be optimized, and why every engineer working in RF, software, hardware, embedded systems, or applications will need a working understanding of machine learning.
1. The shift: AI leaves the cloud
Not long ago, the common pattern was simple: devices collected data, sent it to the cloud, and the cloud made the “smart” decision. That model still exists - but it is no longer enough for many real systems.
Today we see a move toward edge computing: doing more computation close to where the data is generated. Cloud AI still matters and will remain essential for training and heavy workloads, but when the computation is pushed closer to the device and is AI-driven, we call it edge AI. The practical reason is straightforward: many systems cannot afford delays, connectivity problems, or constant data transfer.
Three forces are pushing AI onto devices:
Low latency: interactive applications, real-time control, and RF adaptation often need decisions in seconds or even faster.
Privacy-by-design: when raw audio, images, telemetry, or user behavior never leaves the device, privacy and compliance are easier to guarantee.
Cost and reliability: bandwidth, cloud costs, and network outages become less painful when the device can think locally.
Once you accept those constraints, the technical goal becomes clear: run on-device inference efficiently, even on limited hardware.
2. Where AI runs: from microcontrollers to AI PCs
AI does not run on just one “type of computer”. It runs across a spectrum of platforms, each with different constraints and strengths. In practice, systems often use both Cloud AI and local compute: the cloud is used for training and heavy computation, while devices run inference locally when latency, privacy, or reliability matters.
Microcontrollers (MCUs) are the smallest class. They often have kilobytes of RAM and strict power limits. Yet they can run compact models through TinyML - useful for tasks like anomaly detection, gesture recognition, or simple classification from sensors.
Embedded Linux devices (small boards or modules running Linux) provide more memory, multicore CPUs, and sometimes accelerators. They are common in robotics stacks, industrial gateways, and edge servers.
Modern consumer and industrial devices increasingly rely on System-on-Chip (SoC) designs, where CPU cores, memory controllers, and I/O live on a single chip. Many SoCs include a dedicated NPU (Neural Processing Unit) to accelerate neural network operations efficiently.
All of this leads to heterogeneous computing: a system where different compute blocks (CPU, GPU, NPU, DSP) share the workload. Performance is no longer only about CPU frequency; it is about mapping the right operations to the right engine.
3. The engineering trick: making models fit
Running machine learning on limited devices is not magic - it is disciplined optimization. The same idea appears again and again: reduce what the model needs (memory, compute, energy) while keeping enough accuracy for the job.
Model compression is the umbrella term for these techniques. The most common tools are:
Quantization: using lower-precision numbers (for example, 8-bit integers instead of 32-bit floats). This usually reduces model size and speeds up inference.
Pruning: removing weights or channels that contribute little, making the model smaller and sometimes faster.
Knowledge distillation: training a small “student” model to imitate a large “teacher” model, often keeping good accuracy at a fraction of the cost.
At a deeper level, teams increasingly use hardware–software co-design: choosing model architectures that match the target device’s memory hierarchy and the set of operations that the accelerators can execute efficiently.
The result: models that are not only accurate in a notebook, but reliable in a product.
4. Constraints affecting the process
The model with the highest benchmark score is not automatically the right choice for deployment. In real projects, the deployed model is the one that meets the system constraints, and selecting it is a process: choosing the candidate model, optimizing it, benchmark testing, and validating it. This process also depends on choosing the system itself and clearly defining what constraints the system imposes.
In other words, deployment is not a simple “pick the best model on paper.” It is a process where performance must survive real constraints: latency, memory, compute, thermals, cost, reliability, and the environment where the device operates.
Energy efficiency is one of the key constraints, especially in embedded or thermally limited devices. Over time, fatigue (FATIC) or aging, external environmental impact, and the nature of the sensor itself can cause missing data over time (if you don’t treat the data accordingly).
Another major challenge is data drift: the real-world input distribution changes compared to what the model saw during training. A model should be maintained after deployment (monitoring, updating, re-validation) - these touches taking into account real sensor behavior, missing data, drift, and system constraints.
5. Why every engineer needs AI basics
As AI becomes part of shipped systems, companies need specialists who can make AI reliable over time. This is where the ML engineer role grows.
An ML engineer is not only someone who trains a model. They build the end-to-end system: data pipelines, evaluation, deployment, monitoring, updates, and rollback strategies.
As AI becomes a default capability of platforms, engineers in every one of these domains will interact with ML processes, particularly models - even if they do not train them.
Let’s see how it could be used in different applications.
Glossary
RF Engineering
ML can help with channel estimation, interference detection, signal classification, and adaptive resource management. To use these tools safely, RF engineers need to understand what the model is optimizing and where it can fail.
Embedded Engineering
On-device inference turns raw sensor streams into decisions. Engineers must reason about memory limits, latency budgets, quantization effects, and robustness - and also power usage for a model power budget.
Hardware Engineering
Hardware AI changes how we design, test and validate systems. It also helps us to bring the idea to the hardware requirements.
Software Engineering
ML sits inside products (search, ranking, personalization, anomaly detection). Engineers must interpret metrics, detect regressions, and understand data pipelines.
Application Engineering
In application engineering, we must account for the application requirements from the start. The same device may be used in different places, environments, and configurations, so the requirements can change depending on where and how it is used. If we do not consider these differences, the system may work well in one setting but degrade or fail in another.
6. What this means for the next decade
If you zoom out, a simple pattern emerges:
Hardware is becoming AI-capable by default (SoCs with NPUs, edge modules, efficient runtimes).
Models are becoming smaller and smarter through compression and co-design.
Organizations will need AI-literate engineers everywhere.
AI on hardware becomes more realistic and will be a part of engineering roadmap.
Key concepts (short explanations)
Cloud AI
AI training and/or inference performed in centralized cloud infrastructure.
Edge computing
Computing done close to where data is generated (devices, gateways, local modules).
Edge AI
AI inference performed on edge devices rather than in a remote data center.
On-device inference
Running a trained model locally on a device.
Microcontroller (MCU)
A small, low-power computer on a chip used in embedded products.
TinyML
Methods and tools for running ML models on microcontrollers and other ultra-low-power devices.
Embedded Linux
An embedded device that runs a Linux operating system.
System-on-Chip (SoC)
A single chip that integrates CPU cores, memory controllers, and I/O (and often accelerators).
Neural Processing Unit (NPU)
A hardware accelerator optimized for neural-network operations with high performance per watt.
Heterogeneous computing
A design where multiple compute engines (CPU, GPU, NPU, DSP) share workloads.
Model compression
Techniques that reduce model size and compute cost while keeping performance acceptable.
Quantization
Reducing numeric precision (e.g., FP32 to INT8/INT4) to decrease memory usage and speed up inference.
Pruning
Removing redundant weights or channels from a model to reduce size and sometimes increase speed.
Knowledge distillation
Training a smaller model (student) to mimic a larger model (teacher).
Hardware–software co-design
Designing the model and deployment pipeline with the target hardware in mind.
Latency
The time it takes for a system to produce an output.
Energy efficiency
How effectively a system performs inference under a limited power/thermal budget.
Power budget
A defined limit for how much power the model/system may consume to stay stable and safe.
Data drift
A change in input data patterns after deployment, which can reduce model quality over time.

