The Purpose of the Journal is to introduce the new products, solutions, and technologies that have been designed and developed in the Engineering City.
Published by the Engineering Association
The New Products JournalIssue 1/2026Published by the Engineering AssociationYerevan, June 22, 2026
We used to have a section on New Products in the general EC Journal. We have decided to take that section out and dedicate a separate Journal to it. This is because creating products, solutions, and technologies for the marketplace is the main purpose of the Engineering City and its companies.
It is also our hope that having a dedicated journal for the new products will encourage companies to announe them to the EC Community first. This will insure that all EC companies are aware of the new products, solutions, and technologies that are designed and developed by their peers in the EC and will use them in their own work.
USS DSI3 Ultrasonic Sensor Simulator – by YEA Engineering
by YEA Engineering
Modern vehicles are equipped with multiple features for driving assistance. One such feature is the Park Assist System (Parktronic), which helps drivers easily locate free parking spaces and perform accurate and safe parking. This system utilizes multiple ultrasonic sensors installed on the front and rear bumpers, along with an advanced, high-technology parking control module (Ultrasonic ECU) that enables these capabilities. The YEAE DSI3 USS Ultrasonic Sensor Simulator can emulate up to 16 ultrasonic sensors using the 3rd Distributed Systems Interface (DSI3) to test the functionality of the parking control module.
Key Features
▪ Ability to receive the input scene and object information of the parking scenario through an Ethernet port from the virtual vehicle simulation platform to convert the received UDP packets into proper DSI3 slave response commands by using three discrete current-level signal structures according to the DSI3 Reverse Communication Channel Physical Layer requirements.
▪ Ability to receive master commands according to the DSI3 Forward Channel Physical Layer requirements and decode the Manchester-1 format signals.
▪ Currently support Elmos E524.17 and E524.20 ICs.
▪ Support for the DSI3 ultrasonic sensor model EEPROM data structure.
▪ Available in bench top and rack mount form factors.
▪ User-friendly GUI (it can be installed on any Windows PC) that allows the user to set specific object distance values to be simulated for each ultrasonic sensor (for self-testing purposes), as well as numeric indicators displaying the object information received from the virtual vehicle simulation platform.
▪ DSI3 Reverse and Forward channel data logging to perform DSI3 bus messaging analysis between the DSI3 Master (Ultrasonic ECU) and DSI3 Slave (Sensor).
High Level Architecture
DSI3 Data Sniffer
The integrated DSI3 Data Sniffer enables non-intrusive, real-time monitoring of communication between the DSI3 Master and Slave devices. It captures both Forward and Reverse channel messages without disturbing bus operation, providing engineers with a powerful tool for debugging, protocol compliance analysis, and validation. By allowing message sequences to be logged and reviewed, the sniffer helps accelerate root-cause analysis, supports regression testing, and reduces development time when integrating ultrasonic sensors with the ECU.
The DSI3 Data Sniffer feature is available as both a hardware add-on module and a software analysis package, supplied under separate part number. The hardware module provides physical bus monitoring with isolation and timestamp accuracy, while the software package offers decoded frame visualization, filtering, and logging capabilities for post-analysis also permits real-time observation of Forward and Reverse channel waveforms.
The sniffer can be configured to monitor from one up to four independent DSI3 buses simultaneously, each supporting multiple slave channels, enabling scalable analysis for single-bus and multi-bus system configurations.
Ultrasonic Ultrasonic Ultrasonic YEAE DSI3 USS Parking Parking Parking With Data SnifferSensor 1Sensor 2Sensor N
DC + DSI3 DSI3 DSI3 Bus 1*01* InOut DSI3 Bus 2 ECU
DSI3 Bus N
Fault Insertion Unit
The integrated Fault Insertion Unit (FIU) allows controlled injection of electrical faults into the DSI3 communication
lines to evaluate the robustness and fault-handling capability of the ultrasonic ECU. It supports configurable short-to-
ground, short-to-VBAT, and cross-connection faults between DSI3 buses, enabling comprehensive validation of
diagnostic functions and ECU response mechanisms.
By simulating real-world fault conditions, the FIU helps engineers verify system safety, diagnostic coverage, and fault
recovery algorithms in compliance with automotive reliability standards. The module is fully software-controlled
through the host GUI or via TCP commands, allowing automated fault scripting and repeatable test sequences without
manual rewiring. The Fault Insertion Unit is available as an optional hardware expansion, supplied under a separate part number, and can be combined with the YEAE DSI3 USS and YEAE DSI3 Data Sniffer for advanced debugging and